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http://www.buddies-tech.com BTM312 datasheet 1 BTM312 bluetooth module data sheet document type: bluetooth module datasheet document version: v1.0 release date: march 14, 2012 reproduction of this document, in part of in whole, by any means is prohibited without written permiss ion from buddies technology limited. the information co ntained herein is believed to be accurate as of the date of publication. however, buddies technolog y is not liable for any damages, including indirect or consequential from the use of software this document represents, or any reliance of the accuracy of this document. buddies technology reser ves the right to change the contents of this document at any time without notice. this document contains proprietary confidential tra de secrets and may be subject to additional restrictions contained in the licensing agreement u nder which this document was obtained.
http://www.buddies-tech.com BTM312 datasheet 2 revision history date version description author 2012-03-14 v1.0 first release
http://www.buddies-tech.com BTM312 datasheet 3 content 1. introduction.................................... ................................................... .......................................... 4 1.1 b lock d iagram ................................................... ................................................... ........................... 4 1.2 f eatures ................................................... ................................................... ...................................... 5 1.3 a pplications ................................................... ................................................... ............................... 6 2. general specification .......................... ................................................... ............................... 7 3. physical characteristic......................... ................................................... ........................... 8 3.1 pin description................................ ................................................... ................................................. 9 4. reference schematic ............................ ................................................... ............................. 12 5. physical interface???????????????????????????? ..13 5.1 p ower s upply ................................................... ................................................... ............................. .13 5.2 a udio i nterfaces ................................................... ................................................... .................................................13 5.2.1 adc ......................................... ................................................... ............................................... 13 5.2.2 adc sample rate selection and warping ....... ................................................... ...................... 14 5.2.3 adc gain..................................... ................................................... ........................................... 14 5.2.4 dac ......................................... ................................................... ............................................... 14 5.2.5 dac sample rate selection and warping ....... ................................................... ...................... 14 5.2.6 dac gain..................................... ................................................... ........................................... 14 5.2.7 mono operation .............................. ................................................... ........................................ 14 5.2.8 audio input stage............................ ................................................... ........................................ 15 5.2.9 microphone input ............................ ................................................... ....................................... ..15 5.2.10 audio output stage ......................... ................................................... ........................................ 15 5.2.11 pcm??????????????????????????????????? 15 5.3 rf i nterface ................................................... ................................................... .............................. 16 5.4 g eneral p urpose a nalog io ................................................ ................................................... ...... 16 5.5 g eneral p urpose d igital io ................................................ ................................................... ....... 16 5.6 s erial i nterfaces ................................................... ................................................... ...................... 16 5.6.1 uart ........................................ ................................................... .............................................. 16 5.6.2 usb ......................................... ................................................... ................................................ 16 5.6.3 spi ......................................... ................................................... .................................................. 17 6. electrical characteristic ...................... ................................................... ...................... 18 6.1 a bsolute m aximum r ating ................................................... ................................................... ..... 18 6.2 r ecommended o perating c onditions ................................................... ....................................... 18 6.3 i nput / output t erminal c haracteristics ................................................... ................................. 18 6.3.1 digital terminals............................ ................................................... ......................................... 18 6.3.2 usb ......................................... ................................................... ................................................ 19 6.3.3 internal codec - analogue to digital converte r ................................................. ....................19 6.3.4 internal codec - digital to analogue converte r ................................................. ....................20 6.3.5 microphone input ............................ ................................................... ........................................ 20 6.3.6 speaker output .............................. ................................................... .......................................... 21 6.4 p ower consumptions ................................................... ................................................... ................. 21 7. recommended temperature reflow profile.......... ............................................... 22 8. packaging information .......................... ................................................... .......................... 23
http://www.buddies-tech.com BTM312 datasheet 4 1. introduction the BTM312 bluetooth ? module is a perfect solution for enhanced audio ap plications, such as stereo headphones and high performance auto mobile handsfree. it can be connected with any bluetooth ? devices in an operating range. it is slim and ligh t so the designers can have better flexibilities for the pro duct shapes. the BTM312 bluetooth ? module complies with bluetooth ? specification version 2.1. it supports hsp, hfp, a2dp, avrcp, pbap, spp, profiles . it integrates rf baseband controller, antenna, etc. and provide uart interfac e, programmable i/o, stereo speaker output, microphone input, etc. the detail information of BTM312 bluetooth ? module is presented in this document below. 1.1 block diagram +3v3 pcm bluecore3 - mm
http://www.buddies-tech.com BTM312 datasheet 5 1.2 features small overall dimension(11.938mm x 23.241mm x 2mm) bluetooth specification v2.1 class 2 and class 3 support physical connection as smd type dsp co-processor 16-bit internal stereo codec with -95db snr for dac. high quality stereo audio (sample rate up to 44.1kh z) built-in rf combo filter, integrated 26m crystal. supports up to 8 mbits on module flash memory. support active inquire bt device and pairing. support hsp, hfp, a2dp, avrcp, opp, spp, pbap, sync , pb-sync for nokia, pb-sync for samsung profile. support active inquire bt device and pairing. support customizable pin code and device name. support pairing up to 8 bluetooth ? device. compatible with csr cvc software echo cancellation solution. no radio signal interference, support for 802.11 co -existence some features are optional for customization on dem and.
http://www.buddies-tech.com BTM312 datasheet 6 1.3 application automobile hands-free applications hands-free car kits for embedded car audio systems bluetooth audio source gateway and data gateways fo r pnd systems high quality stereo bluetooth headsets high quality mono bluetooth headsets bluetooth speakers industrial sensors and controls measurement and monitoring systems
http://www.buddies-tech.com BTM312 datasheet 7 2. general specification bluetooth specification chip set csr bc03-multimedia external module id BTM312 bt standard bluetooth ? v2.1 + edr specification rf tx output power 4dbm (class ii) sensitivity -86dbm@0.1%ber frequency band 2.402ghz~2.480ghz ism band baseband crystal osc 26mhz hopping 1600hops/sec, 1mhz channel space rf input impedance 50 ohms major interface microphone : input (differential) speaker : output (differential) pcm : output uart : tx/rx usb : dp/dn pios antenna profile hsp, hfp, a2dp, avrcp, pbap, ??.. de t ai l ed prof il es d e p e nds on the fir m ware voice processor 32mips kalimba with cvc support power supply voltage 3.0v ~ 3.6v dc working current 35ma typical, depends on profiles standby current <1ma operating environment temperature -40oc to +85oc humidity 10%~90% non-condensing environmental rohs compliant
http://www.buddies-tech.com BTM312 datasheet 8 3. physical characteristic dimension: top view: figure 2 figure 3 figure 4 pin definition:
http://www.buddies-tech.com BTM312 datasheet 9 3.1 pin description pin# pin name pad type description 1 gnd ground ground 2 resetb cmos input with weak internal pull-up active low reset 3 spi_miso cmos output, tri-state, with weak internal pull-down serial peripheral interface output for programming only 4 spi_csb cmos input with weak internal pull-up chip select for synchronous serial interface for programming only, active low 5 spi_clk input with weak internal pull- down serial peripheral interface clock for programm ing only 6 spi_mosi cmos input, with weak internal pull-down serial peripheral interface in put for programming only 7 pio_9 bi-directional with programmable programmable input/output line 8 pio_1 bi-directional with programmable programmable input/output line 9 pio_3 bi-directional with programmable programmable input/output line 10 pio_11 bi-directional with programmable programmable input/output line 11 pio_10 bi-directional with programmable programmable input/output line 12 pio_2 bi-directional with programmable programmable input/output line 13 pio_0 bi-directional with programmable programmable input/output line 14 +3v3 3.3v power input 3.3v power input 15 gnd ground ground 16 gnd ground ground
http://www.buddies-tech.com BTM312 datasheet 10 17 gnd ground ground 18 rf_io analogue transceiver input/output line 19 gnd ground ground 20 aio_0 bi-directional analogue programmable input/output line 21 aio_1 bi-directional analogue programmable input/output line 22 agnd analogue ground analogue ground 23 mic_a_p analogue microphone input positive 24 mic_a_n analogue microphone input negative 25 spk_a_n analogue speaker output negative (left side) 26 spk_a_p analogue speaker output positive (left side) 27 spk_b_n analogue speaker output negative (right side) 28 spk_b_p analogue speaker output positive (right side) 29 +1v8 1.8v power output 1.8v power output 30 +3v3 3.3v power input 3.3v power input 31 usb_dp bi-directional usb data plus, pull up 1.5k when active 32 usb_dn bi-directional usb data minus 33 gnd ground ground 34 aio_3 bi-directional analogue programmable input/output line 35 gnd ground ground
http://www.buddies-tech.com BTM312 datasheet 11 36 gnd ground ground 37 gnd ground ground 38 uart_tx bi-directional cmos output, tri- state, with weak internal pull-up uart data output 39 uart_rx cmos input with weak internal pull-down uart data input 40 pio_5 bi-directional with programmable programmable input/output line 41 pio_6 bi-directional with programmable programmable input/output line 42 pio_4 bi-directional with programmable programmable input/output line
http://www.buddies-tech.com BTM312 datasheet 12 4. reference schematic figure 5
http://www.buddies-tech.com BTM312 datasheet 13 5. physical interface 5.1 power supply the transient response of the regulator is importan t. if the power rails of the module are supplied from an external voltage source, the trans ient response of any regulator used should be 20 s or less. 5.2 audio interfaces audio interface as following features: mono analogue input for voice band and audio band stereo and mono analogue output for voice band and audio band the stereo audio codec uses a fully differential ar chitecture in the analogue signal path, which results in low noise sensitivity and good pow er supply rejection while effectively doubling the signal amplitude. it uses a minimum of external components.the module features a differential stereo audio output interfa ces. 5.2.1 adc the adc consists of a second order digma delta conv erter as show in figure 6. figure 6
http://www.buddies-tech.com BTM312 datasheet 14 5.2.2 adc sample rate selection and warping adc supports the following sample rates: 8khz, 11.0 25khz, 16khz, 22.05khz, 24khz, 32khz,44.1khz. one of the main concerns for stereo wireless music applications is the ability to keep sample rates for the codecs at both ends of the wir eless link in synchronization. a vm function adjusts the sample rate using a ?warping? function to tune the sample rate to the required value. the adc warp function allows the sample rate to be changed by +/-3%, in steps of 1/2 17 , or 7.6ppm. the warp function preserves the si gnal quality ? the distortion introduced when warping th e sample rate is negligible. 5.2.3 adc gain the adc contains two gain stages for each channel, an analogue and a digital gain stage. 5.2.4 dac the dac contains two second order sigma delta conve rters allowing two separate channels that are identical in functionality as sho w in figure 6 . 5.2.5 dac sample rate selection and warping each dac supports the following sample rates: 8khz, 11.025khz, 16khz, 22.05khz, 24khz, 32khz,44.1khz, 48khz. one of the main concerns for the dac used in stereo wireless music applications is the ability to keep sample rates for the codecs a t both ends of the wireless link in synchronization. a vm functio n adjusts the sample rate using a ?warping? function to tune the sample rate to the r equired value. the adc warp function allows the sample rate to be changed by +/ -3%, in steps of 1/2 17 , or 7.6ppm. the warp function preserves the signal quality ? th e distortion introduced when warping the sample rate is negligible. 5.2.6 dac gain the dac contains two gain stages for each channel, a digital and an analogue gain stage. 5.2.7 mono operation mono operation is single channel operation of the s tereo codec. the left channel represents the single mono channel for audio i n and audio out. in mono operation the right channel is auxiliary mono channel that may be used in dual mono channel operation.
http://www.buddies-tech.com BTM312 datasheet 15 5.2.8 audio input stage the audio input stage of the module consists of a l ow noise input amplifier, which receives its analogue input signal from pins mic_a_p and mic _a_n to a second?order - ? adc that outputs a 4mbit/sec single-bit stream into the digital circuitry. the input can be configured to be either single ended or fully diffe rential. it can be programmed for either microphone or line input and has a 3-bit digital ga in setting of the input-amplifier in 3db steps to optimize it for the use of different micro phones. 5.2.9 microphone input check the reference design in figure 5 for the microphone input design. 5.2.10 audio output stage the output digital circuitry converts the signal fr om 16-bit per sample, linear pcm of variable sampling frequency to a 2mbits/sec multi-b it stream, which is fed into the analogue output circuitry. the output circuit comprises a digital to analogue converter with gain setting and output amplifier. its class-ab output-stage is capable of driving a signal on both channels of up to 2v pk-pk- differential into a load of 16 . the output is available as a differential signal between spk_a_p and spk_a_n for the left channel; a nd between spk_b_p and spk_b_n for the right channel. the output is capabl e of driving a speaker directly if its impedance is at least 8 if only one channel is connected or an external re gulator is used. the gain of the output stage is controlled by a 3-b it programmable resistive divider, which sets the gain in steps of approximately 3db. the multi-bit stream from the digital circuitry is low pass filtered by a second order bi-quad filter with a pole at 20khz. the signal is then amplified in the fully differential output stage, which has a gain bandwidth of typical ly 1mhz. 5.2.11 pcm the audio pulse code modulation (pcm) interface sup ports continuous transmission and reception of pcm encoded audio data over bluetooth. pulse code modulation (pcm) is a standard method us ed to digitize audio (particularly voice) for transmission over digital communication channels. through its pcm interface, BTM312 provide hardware support for continual tran smission and reception of pcm data, thus reducing processor overhead for wireless headset applications.BTM312offers a bi-directional digital audio interface that route s directly into the baseband layer of the on-chip firmware. it does not pass through the hci protocol layer. hardware on BTM312 allows the data to be sent to an d received from a sco connection. up to three sco connections can be supported by the pcm interface at any time.
http://www.buddies-tech.com BTM312 datasheet 16 5.3 rf interface the module integrates a balun filter. the user can connect a 50ohms antenna directly to the rf port. 5.4 general purpose analog io the general purpose analog ios can be configured as adc inputs by software. do not connect them if not use. 5.5 general purpose digital io there are nine general purpose digital ios defined in the module. all these gpios can be configured by software to realize various functions , such as button controls, led displays or interrupt signals to host controller, etc. do no t connect them if not use. 5.6 serial interfaces 5.6.1 uart this is a standard uart interface for communicating with other serial devices. the uart interface provides a simple mechanism for communica ting with other serial devices using the rs232 protocol. when the module is connected to another digital dev ice,uart_rx and uart_tx transfer data between the two devices. the remainin g two signals, uart_cts and uart_rts, can be used to implement rs232 hardware f low control where both are active low indicators. 5.6.2 usb there is a full speed (12m bits/s) usb interface fo r communicating with other compatible digital devices. the module acts as a us b peripheral, responding to request from a master host controller, such as a pc. the module features an internal usb pull-up resisto r. this pulls the usb_dp pin weakly high when module is ready to enumerate. it signals to the usb master that it is a full speed (12mbit/s) usb device. the usb internal pull- up is implemented as a current source, and is compliant with section7.1.5 of the u sb specification v1.2. the internal pull-up pulls usb_dp high to at least 2.8v when loa ded with a 15k 5% pull-down resistor (in the hub/host) when vdd =3.1v. this presents a thevenin resistance to the host of at least 900 . alternatively, an external 1.5k pull-up resistor can be placed between a pio line and dp on the usb cable.
http://www.buddies-tech.com BTM312 datasheet 17 5.6.3 spi the synchronous serial port interface (spi) can be used for system debugging. it can also be used for in-system programming for the flash memory within the module. spi interface uses the spi_mosi, spi_miso, spi_csb and spi_clk pi ns. testing points for the spi interface are reserved on board in case that the fi rmware shall be updated during manufacture. the module operates as a slave and thus spi_miso is an output of the module. spi_miso is not in high-impedance state when spi_cs b is pulled high. instead, the module outputs 0 if the processor is running and 1 if it is stopped. thus the module should not be connected in a multi-slave arrangeme nt by simple parallel connection of slave spi_miso lines. figure 7
http://www.buddies-tech.com BTM312 datasheet 18 6. electrical characteristic 6.1 absolute maximum rating rating min max unit storage temperature -40 +150 c operating temperature -40 +105 c pio/aio voltage -0.4 +3.6 v +3v3 voltage -0.4 +3.6 v usb_dp/usb_dn voltage -0.4 +3.6 v other terminal voltages except rf -0.4 3v3+0.4 v 6.2 recommended operating conditions operating condition min typical max unit operating temperature range -40 -- +85 c +3v3 voltage +3.0 +3.3 +3.6 v 6.3 input/output terminal characteristics 6.3.1 digital terminals su pply voltage levels min typical max unit input voltage levels vil input logic level low - 0.3 - +0.25x3v3 v vih input logic level high 0.625*3v3 - 3v3+0.3 v output voltage levels v ol output logic level low, l ol = 4.0ma - - 0.125 v v oh output logic level high, l oh = -4.0ma 0.75x3v3 - 0.625x3v3 v input and tri-state current ii input leakage current at vin=+3v3 or 0v -100 0 100 na ioz tri-state output leakage current at vo=+3v3 or 0v -100 0 100 na with strong pull-up -100 -40 -10 a with strong pull-down 10 40 100 a with weak pull-up -5 -1.0 -0.2 a with weak pull-down 0. 2 +1. 0 5.0 a i/o pad leakage current -1 0 +1 a table 1 table 2
http://www.buddies-tech.com BTM312 datasheet 19 ci input capacitance 1. 0 - 5.0 pf resistive strength rpuw weak pull-up strength at +3v3-0.2v 500k - 2m rpdw weak pull-up strength at 0.2v 500k - 2m rpus strong pull-up strength at +3v3-0.2v 10k - 50k rpds strong pull-up strength at 0.2v 10k - 50k 6.3.2 usb usb terminals min typical max unit input thres ho ld v il i n p u t lo g i c le v e l l o w - - 0 . 3 *3v3 v v ih i n p u t lo g i c le v e l high 0 . 7*3v3 - - v input leakage current gnd < vin < +3v3 (a) - 1 1 5 a ci inp u t c a pa cit a n c e 2.5 - 10 . 0 pf output voltage l evels to c o rrec t ly t e rminated usb cable v il out p u t l og ic l e v el low 0.0 - 0.2 v v ih ou t p u t l o gic level h i g h 2 .8 - +3v3 v 6.3.3 internal codec - analogue to digital convert er paramet e r min typical max unit res o l u tion - - 1 6 bits inp u t sa m p le rate 8 - 44 . 1 khz signal / noise, f in =1khz, bw=20hz->20khz a- weighted thd+n<1% 150mv vpk-pk f sa m p le = 8 k hz - 82 - db f sa m p le = 11 . 0 2 5khz - 81 - db f sa m p le = 1 6 k h z - 80 - db f sa m p le = 22 . 0 5 khz - 79 - db f sa m p le = 3 2 k h z - 79 - db f sa m p le = 44 . 1k h z - 78 - db digi t al g a in - 24 - 21 . 5 db 6.3.4 internal codec - digital to analogue convert er paramet e r min typical max unit res o l u tion - - 1 6 bits o u t p ut sa m p le r a te, fsa m ple 8 - 48 k h z signal / noise, f in =1khz, bw=20hz- >20khz a-weighted thd+n<0.01% 0dbfs s i g n al load - 1 0 0k f sa m p le = 8 k hz - 95 - db f sa m p le = 11 . 0 2 5khz - 95 - db table 3 table 4 table 5
http://www.buddies-tech.com BTM312 datasheet 20 f sa m p le = 1 6 k h z - 95 - db f sa m p le = 22 . 0 5 khz - 95 - db f sa m p le = 3 2 k h z - 95 - db f sa m p le = 4 4 k h z - 95 - db f sa m p le = 4 8 k h z - 95 - db digi t al g a in - 24 - 21 . 5 db g ain r eso l u ti on 1/ 3 2 db 6.3.5 microphone input microphone input min typical max unit inp u t fu l l s c a l e at m ax i m u m ga i n - 4 - m v r m s inp u t fu l l s c a l e at m i ni m u m gi a n (differ e nt i al) 8 0 0 - m v r m s g ain - 3 - 42 db gain re s o l u t io n - 3 - db distort i on at 1 k hz - - - 74 db 3db b a ndw i d t h - 20 khz inp u t i m peda n ce - 6 k thd+n ( m icro p h o ne i n p u t ) @30 m v r m s in p u t - 0. 0 4 - % table 6 table 7
http://www.buddies-tech.com BTM312 datasheet 21 6.3.6 speaker output speaker driver min typical max unit out p ut v o lt ag e fu l l sc a l e s w ing (differential) - 750 - mv r m s thd+n 10 0 k load - - 0.01% % thd+n 16 load - - 0.1% % snr(load=16 , 0dbfs input relative to d i g it a l sile n ce) - 95 - db 6.4 power consumptions operating condition min typical max unit connected idle (sniff 1.28 secs) 0. 1 9 ma connected with audio streaming 30 3 5 40 m a deep sleep idle mode 60 ua table 8 table 9
http://www.buddies-tech.com BTM312 datasheet 22 7. recommended temperature reflow profile the soldering profile depends on various parameters necessitating a set up for each application. the data here is given only for guida nce on solder reflow.
http://www.buddies-tech.com BTM312 datasheet 23 8. packaging information 1. bluetooth ? module: BTM312 2. assembly 3. dimension all rights are strictly reserved. any portion of th is paper shall not be reproduced, copied, or translated to any other forms without permission fr om buddies technology limited.

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